Greetings from CII - TNTDPC: Accelerating Innovation and Design for Sustainable, Reliable & Cost-Effective Packaging
Posted on: 01/Mar/2022 2:53:16 PM
The packaging industry is estimated to grow at 26.7% during the period (2021-2026). Further for any packaging Technology, Integrity, Reliability and Cost are three major vectors that need to be optimized. The business requirement to reduce costs in the supply chain must be balanced very carefully against the technical requirements for product safety and as well as the need to ensure a prompt and hassle-free transportation service.
Increasing market distribution and the development of global supply chains have encouraged the adoption of sophisticated logistical packaging systems. This industry has unique challenges, such as shortened product lifecycles due to evolving consumer tastes, demand uncertainty, shrinking operating margins due to increased competition and increasing pressure from regulators. Also, with more companies taking up the mantle of environment protection, consumers now expect a higher level of eco-responsibility and sustainability has already become a strong focus for the packaging industry. Current trends in this industry include recycling, waste reduction, effective use of box space and lower carbon footprint, all of which can be predicted by simulation.
Today, simulation is helping companies meet these challenges and remain competitive in the market by engineering innovation into their product packaging designs, which increases quality, enhances reliability and makes them more affordable than ever. Huge investments in the food processing, personal care, and pharmaceutical end-user industries are creating scope for expansion of the packaging market.
Below are the challenges that need to be addressed to achieve the sustainable growth in the packaging industry
- Package Safety during Transportation
- Minimal Interaction between Package and Product
- Minimizing Environmental Impact of Packaging (Sustainability)
- Child Resistant Senior Friendly (CRSF) Packaging
In competitive, ever evolving and cost-effective markets it becomes imperative that products manufactured use optimal packaging to meet desired requirements. Using simulation, companies have been able to reduce upto 40% in package weight and upto 50% savings in the material cost, while maintaining the required safety standards.
With the above-mentioned background, we are glad to inform you that the Tamil Nadu Technology Development & Promotion Centre (TNTDPC) of CII in partnership with Indian Institute of Packaging (IIP) is organizing the virtual summit on “Accelerating Innovation and Design for Sustainable, Reliable & Cost-effective packaging” on 10th March 2022 between 1500 Hrs - 1700Hrs in Cisco Webex and powered by Ansys
